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Silicon Wafer and Oxide Silicon Wafer Dice To Small Pieces

Silicon Wafer and Oxide Silicon Wafer Dice To Small Pieces

Silicon wafer cutting is mainly used in the fields of semiconductors, optoelectronics and solar energy, and is one of the important processes for manufacturing chips and optoelectronic components.

 

We can provide any inch silicon wafer dice to small pieces .

In the semiconductor field, silicon wafer cutting is a necessary process for chip manufacturing, while for optoelectronics and solar energy, silicon wafer cutting is a key step in manufacturing optoelectronic chips and solar panels. Through cutting, silicon wafers can be processed into chips and devices of various shapes and sizes, which are widely used in electronic products such as mobile phones, computers, tablets, as well as many fields such as optics, medical care and aviation.

At present, the main silicon wafer cutting methods used are as follows:

1. Mechanical cutting: Using a diamond cutting disc to cut silicon wafers can get a very straight cut, but the cutting speed is slow and it is easy to produce fragments.

2. Laser cutting: Using a laser beam to cut silicon wafers is very fast, but it requires expensive equipment and skilled technical operations, and the dust generated will cause harm to the equipment.

3. Ion beam cutting: Using an ion beam to cut silicon wafers is fast, but it requires expensive equipment and processes, and will leave certain residues on the surface of the silicon wafer.

4. Sheet metal cutting: Using a cutting tool to split the silicon wafer, it is suitable for thicker silicon wafers, but the cut is uneven and the cutting speed is slow.

Part of our stock 

Item NO. Material Diameter Surface Type Orientation Thickness Resistivity Size 
HC156 silicon wafer  3inch SSP P 110 380±10um 0.08-0.1 Ohm.cm 10*10mm
HC310  silicon wafer  5inch SSP P 100 525±15um 5-12 Ohm.cm 10*10mm
HC732 silicon wafer  6inch SSP P 100 675±15um >10000 Ohm.cm 10*10mm
HC594 silicon wafer  6inch SSP N 100 625±15um 2000-10000 Ohm.cm 10*10mm
HC289 silicon wafer  8inch SSP P 100 670±15um 2-100 Ohm.cm 10*10mm
HC235  silicon wafer  4inch SSP N 111 525±15um 0-100 Ohm.cm 3*3mm

Any inquiry pls send to us .We will fiind our stock for you .We have a wide variety of stock .

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