Silicon Wafer and Oxide Silicon Wafer Dice To Small Pieces

We can provide any inch silicon wafer dice to small pieces .

In the semiconductor field, silicon wafer cutting is a necessary process for chip manufacturing, while for optoelectronics and solar energy, silicon wafer cutting is a key step in manufacturing optoelectronic chips and solar panels. Through cutting, silicon wafers can be processed into chips and devices of various shapes and sizes, which are widely used in electronic products such as mobile phones, computers, tablets, as well as many fields such as optics, medical care and aviation.

At present, the main silicon wafer cutting methods used are as follows:

1. Mechanical cutting: Using a diamond cutting disc to cut silicon wafers can get a very straight cut, but the cutting speed is slow and it is easy to produce fragments.

2. Laser cutting: Using a laser beam to cut silicon wafers is very fast, but it requires expensive equipment and skilled technical operations, and the dust generated will cause harm to the equipment.

3. Ion beam cutting: Using an ion beam to cut silicon wafers is fast, but it requires expensive equipment and processes, and will leave certain residues on the surface of the silicon wafer.

4. Sheet metal cutting: Using a cutting tool to split the silicon wafer, it is suitable for thicker silicon wafers, but the cut is uneven and the cutting speed is slow.

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