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According to the classification of manufacturing processes, semiconductor silicon wafers can be mainly divided into polished wafers, epitaxial wafers and high-end silicon-based materials represented by SOI silicon wafers. Single crystal silicon ingots are cut, ground and polished to obtain polished wafers. The polished wafer undergoes epitaxial growth to form an epitaxial wafer, and the polished wafer undergoes processes such as oxidation, bonding or ion implantation to form an SOI silicon wafer.

According to size classification, the size of semiconductor silicon wafers (calculated in diameter) mainly includes specifications such as 125mm (5 inches), 150mm (6 inches), 200mm (8 inches), and 300mm (12 inches).

When the size of the silicon wafer becomes larger, the number of chips on a single silicon wafer increases, which can improve production efficiency and reduce production costs. The area of 300mm silicon wafer is 2.25 times that of 200mm silicon wafer. In terms of the number of chips produced, taking a 1.5cm×1.5cm chip as an example, the number of 300mm silicon wafer chips is 232, and the number of 200mm silicon wafers is 88. 300mm silicon wafer is 200mm silicon wafer. 2.64 times the number of chips.